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  • Vertiv Introduces High-Density Prefabricated Modular Data Center Solution to Accelerate the Global Deployment of AI Computing

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Vertiv Introduces High-Density Prefabricated Modular Data Center Solution to Accelerate the Global Deployment of AI Computing

by Grandangolo Communications / Tuesday, 27 August 2024 / Published in Vertiv

Vertiv™ MegaMod™ CoolChip integrates best-in-class technologies, including high-density liquid cooling, to deliver ready-to-use AI-critical digital infrastructure while reducing deployment times by up to 50% compared to on-site systems

With growing demand for AI capabilities for data centers outstripping supply, developers and operators are focused on introducing new resources as quickly as possible. To support this goal, Vertiv, (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, introduced Vertiv™ MegaMod™ CoolChip, a prefabricated modular (PFM) data center solution equipped with a liquid cooling system and designed to enable efficient and reliable AI processing. The solution can be configured to support the platforms of the most important AI computing providers and can be adapted according to customer needs. By combining the quality and process efficiency offered by off-site manufacturing with the best AI technologies, MegaMod™ CoolChip can reduce the implementation time of critical digital infrastructures for AI by up to 50%.

Building on Vertiv's experience in developing systems prefabricated modular data centers, MegaMod CoolChip was designed to meet the specific requirements of AI computing through an out-of-the-box solution that integrates Vertiv™ CoolChip technology to support direct-to-chip liquid cooling, high-efficiency power protection and distribution, and other critical digital infrastructure technologies. The solution is available worldwide and can be used both to retrofit an existing structure into a modular form and to create a new autonomous data center, supporting up to hundreds of kilowatts per row, with prefabricated units reaching several megawatts.

“MegaMod CoolChip is a fully featured critical digital infrastructure solution that customers can deploy quickly and confidently,” said Viktor Petik, vice president infrastructure solutions at Vertiv. "Factory assembly and testing in a controlled environment help accelerate lead times, as well as ensure cost and time savings. Adding this solution to our portfolio provides greater flexibility to effectively accelerate AI."

Designed for AI Computing

According to most recent Omdia research, the demand for modular solutions and prefabricated micro data centers has been amplified by AI, and Vertiv has been counted among the leaders globally. Vertiv engineers used their knowledge of prefabricated modular structures and AI implementation needs to develop Vertiv™ MegaMod™ CoolChip solutions to support current and future AI requirements. Key features of the solution include:

  • High-density computing: MegaMod™ CoolChip supports the customer's chosen AI compute provider's IT systems, including accelerated computing platforms, integrated into equipment racks with integrated water systems, and high-density Vertiv™ rack power distribution units (rPDUs). Integrated racks from customer-chosen AI compute providers can also be consolidated into prefabricated structures.
  • High-density liquid cooling infrastructure: Vertiv™ chillers and cooling distribution units (CDUs) ensure safe and efficient management of cooling fluids to and from the rack. MegaMod CoolChip uses direct-to-chip cooling for high-power CPUs and GPUs, managing heat dissipation from components not served by direct-to-chip cooling pads. The balance between liquid cooling and air systems is adapted to the design of the AI ​​computing platform to optimize its efficiency.
  • High efficiency energy protection and distribution: Vertiv™ power technologies provide power protection and distribution from the network to the rack, including busways, switching devices and compatibility with the highly efficient Vertiv™ Trinergy™ uninterruptible power supply (UPS) and the Vertiv™ PowerNexus solution, which reduces the size of the power system thanks to the same connection of the UPS and the switching device.
  • Modular assembly: MegaMod CoolChip is supplied in prefabricated units, including the building cabinet and all related systems, which are assembled on-site. It is also available in skid-mounted units, to offer flexibility options for new builds, retrofits and expansions. This is integrated into a controlled and clean manufacturing environment, which reduces risks through the assembly and testing processes.
  • Single supplier responsibility: From initial consultation to configuration, construction, installation, commissioning and full lifecycle services, Vertiv manages all aspects of solution development to streamline processes, reducing customer resource demands and ensuring cost and time efficiency.

Vertiv's MegaMod CoolChip solution can also help meet the sustainability goals of Data Center Operators and Developers. By employing highly efficient advanced technologies, such as direct-to-chip liquid cooling and Vertiv™ power infrastructure, MegaMod CoolChip data centers can improve Power Usage Effectiveness (PUE) values ​​compared to data centers using traditional technologies, resulting in reduced CO₂ emissions.

Tagged under: Vertiv

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