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  • VERTIV has a new system for dissipation of flexible heat and high density, which supports hybrid liquid and air cooling for AI applications

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VERTIV has a new system for dissipation of flexible heat and high density, which supports hybrid liquid and air cooling for AI applications

by Grandangolo Communications / Tuesday, 11 March 2025 / Published in Vertiv

Vertiv™ CoolLoop Trim Cooler is an energy-efficient and space-saving solution designed to operate with variable water temperatures typical of AI and HPC applications

Vertiv, (NYSE: VRT), a global provider of critical digital infrastructure and continuity solutions, has expanded its portfolio of industry-leading thermal management solutions with the new Vertiv™ CoolLoop Trim Cooler, supporting air and liquid cooling applications for AI (artificial intelligence) and HPC (high-performance computing). The solution supports different climatic conditions for data centers and AI plants equipped with hybrid or liquid cooling systems.

Integrating seamlessly into high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and conforms to evolving industry needs for compact, energy-efficient cooling solutions. It offers a reduction of up to 70% in annual energy consumption for cooling, using free-cooling and the mechanical system, and a space saving of 40% compared to traditional devices. Designed to meet the challenges of modern AI systems, the system supports variable inlet water temperatures up to 40°C and the ability to use cold plates at 45°C.

Convenient and simple water connection ports allow for easy, direct system integration for the Vertiv CoolLoop Trim Cooler and Vertiv™ CoolChip CDU coolant distribution units for direct connection to the chip. Vertiv CoolLoop Trim Cooler can also connect to immersion cooling systems. This simplifies installation and operational complexity, enabling compatibility with a wide range of high-density cooling environments and providing customers with time and cost savings.

“AI is fundamentally changing the parameters for cooling modern data centers, requiring innovative approaches to properly manage the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, EMEA thermal business at Vertiv. “Today's announcement and the continued expansion of Vertiv's industry-leading portfolio of high-density thermal management solutions allows us to offer cutting-edge liquid cooling and water cooling solutions ready to meet customer demands related to AI.”

Vertiv™ CoolLoop Trim Cooler uses an environmentally friendly refrigerant and offers tunable cooling capacity up to nearly 3 MW in the air-cooled configuration. Thanks to free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode in multiple seasons and conditions, to reduce electricity consumption and CO2e emissions. It complies with the EU ban on F-gases for 2027, eliminating the need for costly infrastructure redesign or upgrades to meet future regulatory requirements.

For more information on Vertiv CoolLoop, on the CDU Vertiv CoolChip family or other Vertiv solutions for AI optimization consult www.vertiv.com.

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