Vertiv™ MegaMod™ HDX scalable hybrid cooling solution offers capacities up to 10 MW and supports rack densities from 50 kW to over 100 kW per rack
Milan [January 15, 2026] – Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, announces new configurations of Vertiv™ MegaMod™ HDX, a prefabricated power and liquid cooling infrastructure solution designed for high-density computing environments, including artificial intelligence (AI) and high-performance computing (HPC) deployments. The configurations give operators greater flexibility to support rapidly growing power and cooling requirements, optimizing space and speed of deployment. Templates are available globally.
Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the high thermal demands of AI workloads, supporting advanced AI pod environments and GPU clusters. The new compact solution is characterized by a standard module height and can accommodate up to a maximum of 13 racks and offers a power capacity of up to 1.25 MW; the combo solution, with expanded height design, can reach up to 144 racks, supporting power capacities up to 10 MW. Both configurations support rack densities from 50 kW to over 100 kW per rack. Hybrid cooling architectures combine direct-to-chip liquid cooling with air cooling for efficient, high-density thermal management, while prefabricated modular designs enable accelerated deployment and allow customers to scale their data centers as demand grows.
"Today's AI workloads require cooling solutions that go beyond traditional approaches. With Vertiv MegaMod HDX available in both compact and combo configurations, organizations can align their facility requirements by supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centers need most: reliable performance, operational efficiency, and the ability to scale AI infrastructure with confidence," said Viktor Petik, senior vice president, infrastructure solutions at Vertiv.
Vertiv™ MegaMod™ HDX models feature an innovative hybrid cooling architecture that combines direct-to-chip liquid cooling with adaptable air systems within a fully integrated prefabricated pod. The solutions include a distributed redundant power architecture that allows continuous operation even if a module is taken offline. Additionally, the buffer tank thermal backup system allows GPU clusters to maintain stable operations during maintenance tasks or load transitions. This factory-integrated design ensures repeatable accuracy in implementation and provides cost certainty in planning and scaling your AI infrastructure.
The prefabricated design, combined with factory-integrated, fully tested components and Vertiv's global service network, ensures reliable end-to-end support.
Vertiv's broad portfolio of power, thermal and IT management solutions supports a wide range of data center architectures, enabling customers to meet growing density needs with scalable, high-performance infrastructure. Both configurations build on the broad portfolio, which includes the Vertiv™ Liebert® APM2 Uninterruptible Power Supply (UPS), Vertiv™ CoolChip CDU Cooling Distribution Unit, Vertiv™ PowerBar Busway System and Vertiv™ Unify Infrastructure Monitoring Platform.
Vertiv also offers IT rack infrastructures designed to seamlessly integrate and support IT systems, including OCP-compliant Vertiv™ Racks, Vertiv™ CoolLoop RDHx Rear Door Heat Exchanger, Vertiv™ CoolChip In-Rack CDU, Vertiv™ Rack Power Distribution Units, Vertiv™ PowerDirect In-Rack DC Power System, and Vertiv™ CoolChip Rack Fluid Distribution Manifolds.
