Now available in EMEA, the expanded range of Vertiv™ CoolChip CDU units can support every stage of the Liquid Cooling adoption process
Vertiv (NYSE: VRT), a global leader in critical digital infrastructure, today introduced an expansion of the Vertiv™ CoolChip family of CDUs (refrigerant distribution units) with the release of Vertiv™ CoolChip CDU 70, Vertiv™ CoolChip CDU 100 and Vertiv™ CoolChip CDU 600 in Europe, Middle East and Africa (EMEA). These direct-to-chip (DTC) liquid cooling solutions solidify Vertiv's position as a leader in innovation and infrastructure building for AI and HPC. The Vertiv CoolChip CDU 600 model will be shown for the first time in EMEA at the Vertiv stand at the Datacloud Global Congress which will be held in Cannes these days.
“As rack densities and cooling needs increase, customers are demanding liquid cooling solutions that fit their specific deployment strategies, whether retrofitting an existing environment or building a new facility,” said Sam Bainborough, vice president, EMEA thermal business at Vertiv. "The Vertiv CoolChip CDU series offers flexible, scalable solutions that simplify deployment and support long-term development. By reducing integration complexity and adapting to a wide range of data center environments, these CDUs help companies more efficiently deploy liquid cooling."
The new models are designed to adapt to data center environments new construction or retrofit, with in-rack and in-row configurations, and technologies liquid-to-air e liquid-to-liquid. These innovative systems offer a flexible and scalable approach to address growing capacity demands, while accelerating the adoption of liquid cooling.
The Vertiv CoolChip CDU family is part of a complete Vertiv liquid cooling offering and is included in the portfolio Vertiv™ 360AI, which includes power, cooling and services solutions designed to address the complex challenges of AI implementations. Supported by Vertiv™ Liquid Cooling Services – a global end-to-end offering that includes design, installation, commissioning, refrigerant management and maintenance – the range of liquid cooling systems adapts to a wide variety of scenarios ranging from retrofit projects of existing facilities up to the creation of high-density AI and HPC clusters in new buildings.
- Vertiv™ CoolChip CDU 70 is a unit of liquid-to-air distribution for the liquid cooling system that allows quick and advantageous access to liquid cooling for data centers that find themselves retrofitting existing environments or implementing new infrastructures. Designed to leverage existing architecture, this liquid-to-air CDU is ideal for organizations looking to implement liquid cooling capabilities without having to make major infrastructure changes. The system offers up to 70 kW of cooling capacity and is designed to be agile and scalable, helping to reduce the complexity of secondary fluid networks and infrastructure footprint. The integrated controller supports real-time monitoring, monitoring and inter-unit communication, for coordinated thermal performance, simplified management and efficient scalability across multiple racks.
- Vertiv™ CoolChip CDU 100 offers high cooling performance liquid-to-liquid inside the racks, providing data centers with a secure, space-efficient solution for high-density workloads. It is ideal for operators looking to introduce or expand liquid cooling system deployments one rack at a time, supporting incremental growth or experimental AI projects without having to make large-scale changes to the infrastructure. With 100 kW of cooling capacity in a 4U form factor and a large-surface heat stabilizer designed for low ambient temperatures, the Vertiv CoolChip CDU 100 enables optimal heat transfer. An integrated controller offers monitoring and adjustment capabilities to simplify operations and improve visibility. The integrated filtration system and precise temperature control within ±1°C help maintain fluid quality and thermal stability, while the physical separation of plant and IT loops supports safe and efficient system management in mission-critical environments.
- Vertiv™ CoolChip CDU 600 it's a model in-row, liquid-to-liquid, which offers robust and scalable liquid cooling capabilities for high-density AI and HPC deployments. The 600 kW system is designed to meet the needs of hyperscale and colocation environments, supporting in-row configurations and easily integrating with raised floor or retrofit installations. Its design, which includes top or bottom piping connection and available internal collectors, simplifies infrastructure planning and speeds implementation. Featuring a redundant pump system, advanced temperature and fluid quality monitoring, and a flexible approach to deployment, the Vertiv CoolChip CDU 600 offers reliability, visibility and performance for liquid cooling businesses in larger IT environments.
